View MoreZ-Paster100-20-11F Silicone Free Thermal Conductive Gap Filler For Cooling Components To The Chassis Of Frame Z-PasterTM100-20-11S Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elem...View More
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View MoreZ-Paster100-20-11UF Silicone Free Thermal Conductive Material For Graphics Card Thermal Module Z-PasterTM100-20-11UF Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the h...View More
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View MoreTS-TIF100 10020-11 Conductivity Thermal Pads Thermal Conductive Insulator For Radiators Heat Dissipation Structure The TS-TIF®100 10020-11 Series thermally conductive interiace materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.The...View More
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View MoreTIC800D Low-Melting Thermal Interface Material Phase Change Materials Thermal Pad For Electric Motor Control Equipment TIC®800D Series is a high thermal conductivity and high dielectric constant insulating pad. lt consists of a polyimide film substrate coated with a low-melting-point phase change ma...View More
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View MoreTIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling TIC®800G Series is a high-performance, cost-effective thermal interface material featuringa unique grain-oriented structure that enables precise conformity to device surfaces,thereby enhancing the thermal conduction...View More
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View MoreTCP200-30-06A High Thermal Conductivity White Thermal Conductive Plastic Material For Lamp Cup TCPTM200-30-06A is a Thermally Conductive Engineering Plastic developed for the housing design which requires high thermally conductivity and reduces the weight more than 30% comparing with the same alumin...View More
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View MoreTCP200-18-06A White 1.8W / MK Thermal Conductive Plastic With 150℃ Heat Deflection Temperature For Power Transformers TCPTM200-18-06A is a Thermally Conductive Engineering Plastic developed for the housing design which requires high thermally conductivity and reduces the weight more than 30% compari...View More
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View MoreTIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials Product descriptions TlFTM100N-40-10F thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their ...View More
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View MoreTIF500-65-11ES Battery Thermal Pad 8.5W/MKW Thermal Insulator Silicone Pad Product descriptions TIFTM500-65-11ES series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically iso...View More
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View MoreTIF200-10-02U High Quality Thermal Pad Conductive Silicone Thermal Heating Pad Gpu Product descriptions TlF200-10-02U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and el...View More
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View MoreTIF100-20-12S LTD Thermal Pad Thermal Conductive Pad Customized Silicon Thermal Insulation Sheet Thermal Pads For CPU Product descriptions TlFTM100-20-12S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to b...View More
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View MoreTIF100-18-56E High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board Product descriptions TlFTM100-18-56E thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and hig...View More
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View MoreTIF100-10F Premium Soft Silicone Thermal Pad Insulated Thermal Pad Computer Cooling Thermal Pad Product descriptions TlFTM100-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electri...View More
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View MoreTIF100-UF High Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Pad Product descriptions TlFTM100-10UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibra...View More
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View MoreTIS806K-13-08 Electrically Isolating Thermal Conductive Insulating Materials For Power Semiconductors The TIS®806K-13-08 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding insula...View More
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View MoreTIF100-10S Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat Dissipation Conductive Pad Product descriptions TlFTM100-10S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flex...View More
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View MoreTIS812-11-03 Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance The TIS®812-11-03 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding insulatin...View More
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View MoreTIS809-16-02 Low Thermal Resistance Pink 0.229mm Thermally Conductive Insulator For Power Semiconductors The TIS®809-16-02 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding insu...View More
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View MoreTIS805-16-03 High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink The TIS®805-16-03 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding ...View More
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View MoreTIF100-05UF Thermal Pad 1.5W The Thermal Conductivity For CPU Thermal Silicone Pads Thermal Pads Product descriptions TlFTM100-05UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility...View More
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